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ATTO10-S High Vacuum Magnetron Sputtering Coating Machine
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ATTO10-S High Vacuum Magnetron Sputtering Coating Machine
Features:
Multi-station glove box purification protection system
Water oxygen content
Germany Baode solenoid valve modular design, excellent sealing performance
European process requirements
Wide pressure range to 10 -9 Torr
Low exhaust
Excellent film uniformity and deposition rate
Efficient sputtering target utilization
Excellent target management mechanism eliminates the need for thermal paste, management staff, etc.
Compact, modular magnet array
Magnet is not exposed to vacuum, magnet is not exposed to cooling water
During target replacement, the cooling water will not be exposed to the vacuum chamber
Unbalanced operation and compatibility with magnetic materials are available
Full range of accessories (ventilation, chimney, shutters, cluster array, etc.)
Custom sputtering source configuration available
Technical Parameter
Vacuum coating system | ||
|---|---|---|
| Description | Material: Stainless steel 1.4301 (SUS type 304), thickness 5mm, all welding seams are connected by argon arc automatic welding technology; mirror polished inner surface, three treatments on outer surface. Size: 400mm × 400mm × 450mm; 157" × 157" × 177" | |
| Volume | 0.072m³ | |
| Observation window | The door is equipped with a glass observation window (including anti-pollution baffle), which is convenient for observing the working situation at work. Conform to the national standard of X-ray protection | |
Extra vacuum | ≤6. 67x10-5pa （2×10-7Torr） (after baking and degassing) | |
Vacuum recovery time | ≤6.67X10-4 pa(after baking and degassing) | |
| Interface | Three standard interfaces (φ200), expand the installation of molecular pumps and plug-in valves; | |
| Four standard interfaces (CF35) are reserved for extended functions; | ||
| Illumination | LED lighting is located on the side of the vacuum chamber for easy observation | |
| Leak rate | The leak detection shall be carried out according to GB T 32218-2015, and the final acceptance test shall be conducted according to the standard of ≤1x10-10PaL / s. | |
| Vacuum system | ||
| Description | Using "molecular pump + mechanical pump" high vacuum system: | |
| Molecular pump | Pumping speed: 1200L / S, a true quasi-oil-free vacuum system, using down-pumping to avoid the pumping weakness of the molecular pump and improve the pumping speed; the molecular pump is guaranteed for 5 years and provides direct replacement service for damage. * Optional imported molecular pump | |
| Vacuum pump | Specifications: Rotary vane vacuum pump, equipped with oil mist filter, with gas ballast control Flow rate: 36 m³ / h (21 cfm), double substrate, vacuum -3 mbar or dry pump (optional) * Optional dry vacuum pump | |
| Operating voltage | AC 230 V / 50-60 Hz, 10 A or AC 115 V / 50-60 Hz, 20 A (optional) | |
| Pumping speed | Pumping from the atmosphere to 9×10-4Pa≤30min(exposure to the atmosphere for a short time, flushing with dry nitrogen and starting pumping) | |
| Valve | Main valve: CC-200, high-vacuum electric linkage plug-in valve; Front stage valve / bypass valve: GDQ-40 high vacuum pneumatic baffle valve; | |
| Vacuum measurement | "Two low and one high" (two resistance gauges measure low vacuum and one ionization gauge measure high vacuum) Digital display compound vacuum gauge, measuring range from 1 × 105Pa to 1 × 10-5Pa; displayed and controlled by PC Operation interlocking linkage. * Optional imported wide range vacuum transmitter | |
| Vacuum measurement | Part adopts metal seal, part adopts fluorine rubber ring seal; | |
| Substrate stage | ||
| Description | The sample table is made of 304 stainless steel, the substrate is placed directly above the evaporation source (full automatic lifting function), and the tooling is designed according to the size of the substrate to facilitate the user to fix the sample. Customizable high-precision etching mask plate; | |
| Spin | The stepping motor is used to control the rotation, the magnetic fluid is sealed, the motor and the magnetic fluid are coaxial, and there will be no loss of rotation or crawling. The stepper motor is accurately controlled and the speed range is 0-30rpm continuously adjustable | |
| Lift | Adopt stepper motor to control rotation, magnetic fluid seal, precise control, height range 0-100mm continuously adjustable; | |
| Mask | Drawer-type structure, carrying the largest sample less than 120 × 120mm, equipped with Japanese SMC pneumatic substrate baffle, electric linkage automatic control. | |
Coating source | ||
2 "permanent magnetron sputtering target (Target size diameter 50.8mm) | Structure | Centripetal sputtering, the distance between the magnetron target and the sample is adjustable from 90 to 140mm, each target has good water cooling and DC / RF / MF compatibility Electric control baffle assembly: 1 set Equipped with shielding cover to avoid cross contamination between targets (installation and use when non-co-sputtering); Can be folded to the center of the sample above, the distance between the target and the sample is adjustable; |
Number | 3 sets | |
Radio frequency (RF) sputtering power supply | Power | 0~600W |
| Control | Radio frequency (RF) sputtering power supply | |
Number | 1 set | |
DC sputtering power supply | Output power | 0-1000W |
| Control | RS-485 interface, the power supply is continuously adjustable between 0-maximum power. | |
Number | 1 set | |
DC bias power supply | Description | 0~1000W |
| Control | RS-485 interface, the power supply is continuously adjustable between 0-maximum power. | |
Number | 1 set | |
| Ion fast current | Above 1A | |
| Rapid flow area | 30 degree half angle | |
Number | 1 set | |
Gas path system | Description | Process gas, argon (50sccm), oxygen (20sccm) gas mass flow control and display each way. |
| Control | PID intelligent control, equipped with corresponding stop valve and pipeline, etc. | |
Number | 2 path | |
| Crucible | Cold crucible between beams 0-500ma, direct cold crucible 0-1a The capacity of the crucible is 6-hole intercooling 4 × 17ml, 6-hole direct cooling 4 × 22ml, annular direct cooling 85ml The positioning of crucible (four hole crucible) is controlled automatically or manually Water inlet temperature of crucible cooling water ≤ 25 ℃, water inlet pressure ≥ 0.2MPa, water flow ≥ 8L / min | |
Number | 1 set | |
| Control system | ||
| Description | With windows operation platform, cotrl2000 control system and IPC + network technology, the parameterization setting of main parts of the whole machine, real-time monitoring, fault intelligent diagnosis and automatic monitoring of film thickness are realized. There are two modes of automatic and manual control. In addition to taking lofting products, other operation processes are all controlled by software on PC; friendly man-machine operation interfaces such as vacuum system, process setting, gas filling and discharging system are provided; parameters can be set by formula on industrial computer to realize setting, storage and printing of program process and equipment parameters. | |
| Specifications | It can effectively solve the accuracy, stability and reliability of coating. Perfect program interlock, complete anti misoperation design and protection; system water shortage, over flow pressure and other abnormal conditions alarm and implement corresponding protection measures. Rich I / O interface design is adopted to fully meet the functional requirements of expansion and external connected equipment. The display controls the door opening / closing of the coater. Coating process, process, film thickness, convenient and save printing. | |
Film thickness monitoring and control system | ||
| Description | The quartz crystal diaphragm thickness controller is used, and the water-cooled diaphragm thickness probe is installed near the substrate platform and connected with the industrial computer. The film thickness meter is used to monitor the coating rate and final thickness in real time with an accuracy of ± 1a (0.1nm). The real-time information is fed back to the industrial computer. If the coating reaches the set thickness, it can automatically control the power supply, stop coating and realize the purpose of automatic film thickness control. | |
| Range | Monitoring thickness range: 1 Å ~ 99 μ 9999 Å, resolution: 1 Å | |
Feature | The coating process, process and film thickness are all set on PC, which can realize the automatic control of the whole process. The coating process can be set on PC and the data can be recorded. | |
Water cooling system | ||
Description | The cooling water circuit is 8 in and 8 out, and the main water inlet is controlled by water pressure relay. The total water inlet and outlet are connected to 1p refrigeration cycle water machine, with the temperature control range of 10 – 25 ℃. Provide stable cooling water for target, metal source, molecular pump and magnetic fluid to ensure stable operation of equipment. | |
Optional equipment | ||
| Substrate stage | Heating | The special armored heating wire is used to avoid the problems of traditional heating elements polluting the vacuum chamber, polluting the substrate, short life and requiring frequent maintenance. The heating temperature is: room temperature ~ 300 ℃, temperature control adopts imported PID intelligent temperature controller of Japan island power, with temperature control accuracy of ± 1 ℃. |
| Water cooling | Step motor is used to control driving rotation, dynamic sealing, one in one out water flow. | |
| Liquid nitrogen cooling | Patented products: use stepping motor to control drive rotation, magnetic fluid seal, motor and magnetic fluid coaxial, measured temperature - 160 ℃ | |
Film select coating | Patented products: optional film coating, automatic transfer and alignment, adjustable deposition height. | |
| Automatic coordination coating | Patented product: stepless selection and coating function, automatic transfer and alignment of return to zero and return, adjustable deposition height | |
| Stepless turning and rotation | Patented products: realize horizontal and vertical rotation of substrate, stepless rotation and heating, and realize high uniformity coating. | |
| 3 "permanent magnetron sputtering target (target size d76.2mm) | Centripetal sputtering, the distance between the magnetron target and the sample is 90-110mm adjustable, with good water cooling and DC / RF / MF compatibility | |
| 2 "strong magnetron sputtering target (target size d56.8mm) | Centripetal sputtering, the distance between the magnetron target and the sample is 90-110mm adjustable, with good water cooling and DC / RF / MF compatibility | |
| 3 "strong magnetron sputtering target (target size d76.2mm) | Centripetal sputtering, the distance between the magnetron target and the sample is 90-110mm adjustable, with good water cooling and DC / RF / MF compatibility | |
| RF switch | The shift gear function of 1-switch-2 is designed (i.e. one set of power supply can be used for two sets of magnetron sputtering targets at different times). Generally, other parameters of power supply other than power setting need not be adjusted before and after shifting. | |
Vacuum baking / degassing | Double heater design; Power: 1200 W; Mounting flange: cf35; Fast degassing of vacuum chamber to improve vacuum degree; The baking time is shorter than oven and heating belt; | |
| Sampling chamber | Door opening structure, size: about Φ 200 x 300mm Vacuum system: mechanical pump, molecular pump, valve Limit vacuum: ≤ 6.67x10-4 PA (after baking and degassing). Vacuum recovery time: 6.6x10-3 PA in 30 minutes (the system is exposed to the atmosphere for a short time and charged with dry nitrogen) | |
| Chamber heating | The vacuum chamber is equipped with a heating system with a temperature of 200 ℃ and a temperature control of ± 1 ℃ | |
| Water cooling system | The cooling water circuit is 8 in and 8 out, and the main water inlet is controlled by water pressure relay. The total water inlet and outlet are connected to 1p refrigeration cycle water machine, with the temperature control range of 10 – 25 ℃. Provide stable cooling water for metal source, molecular pump and magnetic fluid to ensure stable operation of the equipment. | |
| Optional instructions | ||
| Product certification | ISO9001 certification、CE certification、UL certification | |
| Application considerations | Please refer to the danger, warning, caution and other clauses in the manual for details | |
