Magnetron Sputtering System (Three Target Co-sputtering)
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Magnetron Sputtering System (Three Target Co-sputtering)

Type

EVAP400S

Main vacuum chamber 

Square front door opening structure, dimension L × w × H: 400mm × 400mm × 450mm; L × w × H: 157" × 157" × 177"; 

Vacuum system chamber

Main vacuum chamber

Compound molecular pump, mechanical pump, pneumatic ram valve;

Extra vacuum 

Main vacuum chamber

≤6. 67x10-5pa(after baking and degassing)

Vacuum recovery time 

Main vacuum chamber

It can reach 6. 6x10-4 pa in 30 minutes (the system is exposed to the atmosphere for a short time and charged with dry nitrogen to start pumping)

Sampling Room

It can reach 6. 6x10-3pa in 30 minutes (the system is exposed to the atmosphere for a short time and charged with dry nitrogen to start pumping)

Magnetic control target assembly

2-4 sets of permanent magnet targets; target size: 0.60mm (one of them is sputterable magnetic material); RF sputtering and DC sputtering of each target are compatible; water cooling in the target; three targets can be folded to the sample center above; the distance between the target and the sample is 90-110mm adjustable; each target is equipped with pneumatic baffle.

Substrate heating stage 

Sample size 

ø3"

Moving mode

The substrate can rotate continuously at a speed of 0-30rpm

Heating

The maximum temperature of substrate heating is 600 ℃± 1 ℃

Baffle form

Inlet SMC angle cylinder control

Process gas system

Mass flow controller 2-4 ways

*Optional parts

Sample chamber magnetic control target assembly

Permanent magnet target, target size ø 60mm

Film thickness gauge

Domestic / imported

Silent air pump

Oil free lubrication

Computer control system

Automatic control, process reading, parameter setting, real-time monitoring and other functions

Floor area of equipment

Host

1800X1200mm; 709"X472"