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磁控溅射是物理气相沉积技术(Physical Vapor Deposition, PVD)的一种。一般用于制备金属、半导体、绝缘体等薄膜材料,具有设备简单、易于控制、效率高,面积大等优点。
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磁控溅射是物理气相沉积技术(Physical Vapor Deposition, PVD)的一种。一般用于制备金属、半导体、绝缘体等薄膜材料,具有设备简单、易于控制、效率高,面积大等优点。
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α-2400U Inert Vacuum Controlled Atmospheres Laboratory GloveboxExternal Structure ..
α-2400U Separated Inert Vacuum Controlled Atmospheres Laboratory GloveboxExternal Structure &n..
α-2400U Separated Two-sided Inert Vacuum Controlled Atmospheres GloveboxExternal Structure &nb..
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α-1200U Inert Vacuum Controlled Atmospheres Laboratory Glovebox With Openable Front WindowExternal S..
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α-1200U Inert Vacuum Controlled Atmospheres Laboratory Glovebox With Main Antechamber 200℃ Ove..
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α-1200U Inert Vacuum Controlled Atmospheres Laboratory Glovebox With Main Antechamber 600℃ Ove..
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α-1200U Inert Vacuum Controlled Atmospheres Laboratory Glovebox With -36℃ (-32.8℉) FreezersExternal ..
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α-1200U Inert Vacuum Controlled Atmospheres Laboratory Glovebox With -86℃ (-122.8℉) FreezersExternal..
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